Design, analysis and developmental test capability

Mechanical Desktop

Ansoft HFSS v10 & Maxwell v 11 FEA simulator

Cosmos Thermal and Static/Dynamic FEA

Drawing files in DWG, IGES, & SAT formats etc. can be shared between TRAK and its customer's engineering groups reducing design cycle time. Use this link to download free Autocad viewers to take advantage of the DWG files available from this site.

FEA to simulate electrical and magnetic performance is performance on most new fundemental designs involving microstrip, stripline and waveguide isolator, coupler and filter components.

The ability of TRAK's products to withstand severe dynamic & static stress at operating temperature extremes whilst simultaneously handling incident RF power under full fault conditions can be simulated using the COSMOS FEA design package.

Microwave Component Development

RF Power Testing

Intermodulation Test

Developing and manufacturing RF components requires accurate and reliable RF test equipment . TRAK continues to invest heavily in RF test equipment to ensure validated and compliant designs that can readily be demonstrated to meet customer specifications.

TRAK has a comprehensive range of TWTA, Klystron and SSPA based RF Power test equipment covering most bands from 400 MHz to 20 GHz. Contact the factory to get details on the power and signal characteristics available in your band of interest.

Intermodulation performance in compoents operating in in multi-carrier signal environments require IM3 testing. TRAK has a comprehensive facility operating at 400, 900, 1800 and 2200 MHz used in development and manufacturing.

100grms vibration facility

3D dynamic X-ray facility

8-channel digital glitch system

Prior to the commissioning of this facility in March TRAK subcontracted all vibration to third party providers. With the introduction of this equipment TRAK is able to test sine and random vibration (to 100grms) and shock. Extensive use is made of this facility for parts designed and supplied for space use.

100% Inspection of solder joints is carried out on a basis on all coaxial parts for space applications prior to and at the completion of the screening process. The dynamic x-ray allows hitherto impossible to inspect regions to be clearly visible under exceptional magnitude and clarity.

Continuous measurement of insertion loss with temperature is performed on a 100% basis on coaxial units for Space applications. The system allows up to 8 parts to be tested simultaneously. A short description of this system is available to selected customers upon request.